Both the US and China see advanced chip packaging, once an afterthought, as a path to higher performance; Intel says the US has just 3% of global capacity (Bloomberg)

Both the US and China see advanced chip packaging, once an afterthought, as a path to higher performance; Intel says the US has just 3% of global capacity (Bloomberg)

Bloomberg:
Both the US and China see advanced chip packaging, once an afterthought, as a path to higher performance; Intel says the US has just 3% of global capacity  —  The emerging field of advanced packaging is being hailed as an inflection point for the semiconductor industry.  China is moving in on the same arena.